R.J. Klein Wassink - Soldering in Electronics [Second Edition]
![R.J. Klein Wassink - Soldering in Electronics [Second Edition]](https://cdn.myonlinestore.eu/93d3e6d2-6be1-11e9-a722-44a8421b9960/image/cache/full/98bf0a110555065057bc7b569c668ca43cec4453.jpg?20241114104739)
| Conditie | redelijk [1e pag. naam; vorm en inhoud boek prima] |
| Aantal pagina`s | 753 |
| Uitgavejaar | 1994 [Second Printing] |
| Uitgegeven door | Electochemical Publications Limited |
| Kaft | zwarte hardcover met goudopdruk op de rug |
| Stofomslag | ja |
| ISBN | 090115024X |
| Code [intern] | LIGT |
Beschrijving boek
A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-hole Techniques.
Soldering in Electronics has been written to cover soldering as a technique for mass production of electronic connection, although many items treated will be useful for other branches of solder technology.
The book provides a combination of background knowledge and information for practice. In doing so it helps to clarify many points of basic discussion among soldering experts, such as wetting and dewetting, thermal influences, solderability and methods of its assessment, metallurgy of alloys and coatings, and process conditions. On the other hand it contains a wealth of detailed and practical information on soldering alloys, fluxes, coatings, soldering methods, pattern design, joint reliability and criteria for joint inspection.
In this Second Edition extensive attention is given to surface mounting technology, with subjects like component metallisations, dimensions of footprints of leadless and multi-lead packages, application of solder paste and adhesive, adapted wave soldering and reflow soldering techniques, such as infra-red soldering, vapour phase soldering, resistance soldering and laser soldering.
Specific effects of surface mounting, such as misplacing of components, solder leaching, solder wicking, floating and drawbridging of components are dealt with in detail.
